89 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3002 series sp3002 low capacitance esd protection - sp3002 series description applications the sp3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each i/o pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level ( level 4) speci?ed in the iec 61000-4-2 international standard without performance degradation. their very low loading capacitance also makes them ideal for protecting high speed signal pins such as hdmi, dvi, usb2.0, and ieee 1394. features t - p x d b q b d j u b o d f p g 0.85 pf (typ) per i/o t & 4 % q s p u f d u j p o p g 12kv contact discharge, 15kv air discharge, (iec61000-4-2) t & ' 5 q s p u f d u j p o
iec61000-4-4, 40a (5/50ns) t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m q b d l b h j o h p q u j p o t saves board space t - j h i u o j o h 1 s p u f d u j p o
iec61000-4-5, 4.5a (8/20s) t $ p n q v u f s 1 f s j q i f s b m t t . p c j m f 1 i p o f t t 1 % " t t % j h j u b m $ b n f s b t t / f u x p s l ) b s e x b s f 1 p s u t t 5 f t u & r v j q n f o u t . f e j d b m & r v j q n f o u functional block diagram i/o2 i/o1 gnd i/o3 v cc i/o4 pinout i/o 1 i/o 2 sc70-6 and sot23-6 v cc i/o 3 i/o 4 gnd 1 2 6 3 5 4 gnd i/o 1 nc i/o 4 i/o 2 i/o 3 v cc udfn-6 (1.6x1.6x0. 5 mm) life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example clk+ gnd clk- d2+ gnd d2- d1+ gnd d1- d0+ gnd d0- hdmi or dvi connector hdmi or dvi interface ic d0+ d0- d1+ d1- d2+ d2- clk+ clk- 6 5 4 sp300x-0 4 1 2 3 + 5 v gnd 6 5 4 sp300x-0 4 1 2 3 a single 4 channel sp300x-04 device can be used to protect four of the data lines in a hdmi/dvi interface. two (2) sp300x-04 devices provide protection for the main data lines. low voltage asic hdmi/dvi drivers can also be protected with the sp300x-04, the +v cc pins on the sp300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +v cc of the sp300x-04 can be ?oated or nc. sp3002 series 0.85pf rail clamp array
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 90 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3002 series low capacitance esd protection - sp3002 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 4.5 a t op operating temperature -40 to 85 c t stor storage temperature -50 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6.0 v reverse leakage current i leak v r =5v 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 9.5 11.0 v i pp =2a, t p =8/20s, fwd 10.6 13.0 v esd withstand voltage 1 v esd iec61000-4-2 (contact) 12 kv iec61000-4-2 (air) 15 kv diode capacitance 1 c i/o-gnd reverse bias=0v 0.95 1.1 1.25 pf reverse bias=1.65v 0.7 0.85 1.0 pf diode capacitance 1 c i/o-i/o reverse bias=0v 0.5 pf note: 1. parameter is guaranteed by design and/or device characterization. capacitance vs. bias voltage insertion loss (s21) i/o to gnd -20 -1 5 -10 - 5 0 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 frequency [hz] insertion loss [db] 0.0 0. 5 1. 0 1. 5 2.0 2. 5 3.0 3. 5 4.0 4. 55 .0 1. 5 0 1.40 1.30 1.20 1. 10 1. 0 0 0.90 0.80 0.70 0.60 0. 5 0 i/o capacitance (pf) i/o dc bias (v) v cc = 5 v v cc = 3.3v v cc = float
91 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3002 series sp3002 low capacitance esd protection - sp3002 series capacitance vs. frequency 0 2e-13 4e-13 6e-13 8e-13 1e-12 1.2e-12 1.4e-12 1.6e-12 1.8e-12 2e-12 1.e+06 1.e+07 1.e+08 1.e+09 frequency [hz] capacitance [f] time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat prehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters product characteristics lead plating sc70 & sot23: matte tin udfn: pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13.
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 92 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3002 series low capacitance esd protection - sp3002 series package dimensions sc70-6 package sc70-6 pins 6 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 d a2 a a1 c l e he 2 1 3 6 5 4 e e b solder pad layout package dimensions sot23-6 package sot23-6 pins 6 jedec mo-203 issue a millimeters inches notes min max min max a 0.900 1.450 0.035 0.057 - a1 0.000 0.150 0.000 0.006 - a2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - c 0.080 0.220 0.0031 0.009 - d 2.800 3.000 0.11 0.118 3 e 2.600 3.000 0.102 0.118 - e1 1.500 1.750 0.06 0.069 3 e 0.95 ref 0.0374 ref - e1 1.9 ref 0.0748 ref - l 0.100 0.600 0.004 0.023 4,5 n 666 a 0o 10o 0o 10o - m 2.590 0.102 - o 0.690 .027 typ - p 0.990 .039 typ - r 0.950 0.038 - o p r m recommended solder pad layout notes: 1. dimensioning and tolerances per ansi 14.5m-1982. 2. package conforms to eiaj sc-74 (1992). 3. dimensions d and e1 are exclusive of mold ?ash, protrusions, or gate burrs. 4. footlenth l measured at reference to seating plane. 5. l is the length of ?at foot surface for soldering to substrate. 6. n is the number of terminal positions. 7. controling dimension: millimeter. converted inch dimensions are not necessarily exact.
93 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3002 series sp3002 low capacitance esd protection - sp3002 series package dimensions udfn (1.6x1.6x0.5mm) udfn (1.6x1.6x0.5mm) symbol millimeters inches min max min max a 0.45 0.55 0.018 0.022 a1 0.00 0.05 0.000 0.002 a3 0.127 ref 0.005 ref b 0.20 0.30 0.008 0.012 d 1.50 1.70 0.060 0.067 d2 1.05 1.30 0.042 0.052 e 1.50 1.70 0.060 0.067 e2 0.40 0.65 0.016 0.026 e 0.50 ref 0.020 ref l 0.25 0.40 0.010 0.016 d e b 1 2 3 6 5 4 t op view pin 1 index area a a 1 2 3 5 4 6 l pin 1 chamfer 0.10 x 4 5 ? 0.0 5 c bottom view 0.0 5 c 0.0 5 c b a1 a3 c seating plane side view 0.10 c a m b 0.0 5 c m d2 e2 ordering information part number package marking min. order qty. sp3002-04htg sot23-6 ex4 3000 sp3002-04jtg sc70-6 ex4 3000 sp3002-04utg udfn-6 (1.6x1.6x0.5mm) ex4 3000 part numbering system part marking system sp 3002 -04 x t g series package h = sot23-6 j = sc70-6 u = udfn-6 t= tape & reel g= green number of channels -04 = 4 channel silicon protection array (spa tm ) family of tvs diode arrays e x 4 e x 4 product series e = sp3002 series assembly site (varies) number of channels
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 94 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3002 series low capacitance esd protection - sp3002 series embossed carrier tape & reel speci?cation sot23-6 embossed carrier tape & reel speci?cation udfn-6 (1.6x1.6x0.5mm) 8mm tape and reel general information 1. 3000 pieces per reel. 2. order in multiples of full reels only. 3. meets eia-481 revision "a" specifications. 2.0mm 4.0mm c l 1. 7 5 mm 1. 5 mm dia. hole 8mm 4.0mm 8.4mm 180mm 14.4mm 13mm 60mm access hole user direction of feed pin 1 sot-23 (8mm pocket pitch) k0 a0 b0 p2 d1 p0 t f e w d symbol millimetres inches min max min max e 1.65 1.85 0.06 0.07 f 3.45 3.55 0.14 0.14 d1 1.00 1.25 0.04 0.05 d 1.50 min 0.06 min p0 3.90 4.10 0.15 0.16 10p0 40.0+/- 0.20 1.57+/-0.01 w 7.90 8.30 0.31 0.33 p2 1.95 2.05 0.08 0.08 a0 1.78 1.88 0.07 0.07 b0 1.78 1.88 0.07 0.07 k0 0.84 0.94 0.03 0.04 t 0.25 typ 0.01 typ embossed carrier tape & reel speci?cation sc70-6 symbol millimetres inches min max min max e 1.65 1.85 0.064 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1.00 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0+/- 0.20 1.574+/-0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.14 2.34 0.084 0.092 b0 2.24 2.44 0.088 0.096 k0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max
|
